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| GR3K FAST RECOVERY SURFACE MOUNT RECTIFIERS PRODUCT SUMMARY Reverse Voltage 50 to 1000 Volts Forward current 3.0 Amperes FEATURES For surface mounted application Glass passivated junction chip Built-in strain relief, ideal for automated placement Plastic material used carries Underwriters Laboratory Classification 94V-O Fast switching for high efficiency High temperature soldering: o 250 C /10 seconds at terminals MECHANICAL DATA Cases: Molded plastic Terminals: Solder plated Polarity: Indicated by cathode band Weight: 0.007 ounce, 0.21 gram Pb-free; RoHS-compliant 07/04/2007 Rev.1.00 www.SiliconStandard.com 1 GR3K MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20% Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current See Fig. 1 @ TL=75oC Peak forward surge current, 8.3 ms single half sinewave superimposed on rated load (JEDEC method) Maximum instantaneous forward voltage @ 3.0A Maximum DC reverse current at rated DC blocking voltage @TA=25oC @TA=125oC Symbols VRRM VRMS VDC I(AV) IFSM VF IR trr CJ RJA RJL TJ TSTG 150 75 50.0 15.0 -55 to +150 -55 to +150 o o GR3A 50 35 50 GR3B 100 70 100 GR3D 200 140 200 GR3G 400 280 400 3.0 100.0 1.3 10.0 250 GR3J 600 420 600 GR3K 800 560 800 GR3M 1000 700 1000 Units Volts Volts Volts Amps Amps Volts uA Maximum reverse recovery time (Note 1) Typical junction capacitance (Note 2) Typical thermal resistance (Note 3) Operating temperature range Storage temperature range 250 500 nS pF C/W o C C o Notes: 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A 2. Measured at 1 MHz and Applied VR=4.0 Volts 3. Thermal Resistance from Junction to Ambient and from Junction to Lead Mounted on P.C.B. with 0.3" x 0.3" ( 8.0 x 8.0 mm ) Copper Pad Areas. 07/04/2007 Rev.1.00 www.SiliconStandard.com 2 GR3K RATINGS AND CHARACTERISTIC CURVES (TA=25 C unless otherwise noted ) o Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 07/04/2007 Rev.1.00 www.SiliconStandard.com 3 |
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